TECHNICAL DATA > HDI-SBU PCBs

   
A technological solution for High-Density PCBs

pdficon.png 		HDI-SBU PCBs
 
   
TECHNICAL DATA
Construction
  • Up to 32 Layers
  • Sequential multilayers
Base copper thickness
  • 5µ, 9µ, 12µ, 18µ, 35µ, 70µ, 105µ
Dimensions
  • Maximum PCB size: 478 x 592 mm
  • Maximum thickness: 5 mm
Base Materials
  • High Tg epoxy (Tg>175°C) compatible RoHS
  • Materials for high frequencies (4 to 15 Ghz)
  • Polyimide
  • ROGER 4350
  • Green material (halogen free)
Surface Finishing
  • Electroless Nickel/Gold (ENIG)
  • Electroplated Nickel/Gold
  • Immersion tin
  • Tin Lead reflow
  • OSP
Line & Spacing
  • External standard: 60µ/75µ
  • Internal standard: 50µ/75µ
  • Internal advanced: 40µ/60µ
Blind vias (mechanical)
  • Drilling diameter: 100µ
Thru hole
  • Min drilling diameter: 150µ
  • Aspect ratio: 16:1
Laser vias
  • Sequential multilayers (3 levels)
  • Stacked microvias
  • Via copper filling
  • Drilling diameter: 75µ
BGA
  • Up to 1980 I/O
  • Pitch: 1, 0.8, 0.65, 0.5, 0.4, 0.3 mm
Flip Chip
  • < 250µ pitch
Impedance Check
  • Tolerance of impedance: ± 10 %
  • Reflectometer Polar
Tests
  • 100% Automatic-Optical-Inspection
  • 100 % electrical test
  • Visual inspection
Quality Controls
  • Guarantee of custom-designed quality standards and production according to international guidelines:
  • Vision 2000 - CNES - AS9100B
  • EN9100:2003/S1
  • JISQ9100:2004
  • UL Certified: 94V-0 up to 130°

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