TECHNICAL DATA > Flexible and Rigid-Flexible PCBs

   
The process technologies implemented and the in-depth product knowledge have allowed Elco to increasingly make its name in the production of
Rigid-Flex printed circuit boards
of up to 20 layers.

pdficon.png
Rigid-Flex PCBs
 
   
TECHNICAL DATA
Construction
  • FR4 Std Tg 135°
  • FR4 Medium Tg > 150°
  • FR4 Hi Tg > 175°
  • Polyimide
  • Insulation Polyimide:
  • 25 μm, 50 μm, 70 μm
Dimensions
  • Minimum pcb thickness: 0.26" (6.5 mm)
  • Maximum board Dimension: 25.2"” x 22.4" (640 x 570 mm)
Surface Finishing
  • Organic copper passivation
  • Hot air levelling (HASL)
  • Electroless nickel/gold
  • Electroplated nickel/gold Other surfaces on request
Solder Masks
  • Screen printing of solder mask (uv-drying)
  • Peelable solder mask
Special Printings:
  • Screen printing of solder mask (uv-drying)
  • Peelable solder mask
Track Width/Space:
  • Standard : 100 µm
  • High-Tech: 75 µm
  • Next step: 50 µm
Drill Diameter (mechanical):
  • Standard : 200 µm
  • High-Tech: 150 µm
  • Next step: 75 µm
Counter Processing:
  • Milled
  • Scored (counter or perforation) possibly with frame(delivery in rigid form)
Impedance Check
  • On request
  • Tolerance of impedance: ± 10 %
Tests
  • Automatic-Optical-Inspection
  • 100 % electrical test
  • Special check on request
  • Visual inspection
Quality Controls
  • Guarantee of custom-designed quality standards and production according to international guidelines:
  • Vision 2000 - CNES - AS9100B
  • EN9100:2003/S1 - JISQ9100:2004
  • UL Certified: 94V-0 up to 130°

Login