TECHNICAL DATA > EQUIPMENTS

 

   

PHOTOTOOLS

EQUIPMENT DESCRIPTION QTY
AOI of phototools AOI BarcoHs
AOI Orbotech
2
4
AOI CAD reference (CAM) Fiber optic connection 2
Photoplotting Laser plotter Barco
Laser plotter Orbotech
2
1
Film scan and conversion Scanner + Scanfab software 1
Cam Station Barco / Enterprise / CAm350 20
 
   

PRIMARY IMAGE APPLICATION

EQUIPMENT DESCRIPTION QTY
Dry film 1600 - SPC (Rohm and Haas) 4
Dry film Csun 2
 
   

IMAGING

EQUIPMENT DESCRIPTION QTY
Double side CBT E2000-5KAC, ORC HMW201B-5K (UV light) 2
Double side Bacher with automatic adjustment (UV light) 1
Double side ORC 4
Double side Dupont 130 1
Double side Csun (5KW) 2
Double side Csun (7KW) 2
LDI UV- PARAGON 8000 (laser) from Orbotech 1
LDI UV- PARAGON 8000 (laser) from Orbotech 1
 
   

ETCHING

EQUIPMENT DESCRIPTION QTY
Cupric chloride Horizontal line - DES line (producer: Kuttler) 1
Ammoniacal Horizontal line (producer: IS) 3
Ammoniacal Horizontal line (producer: Holmuller) 1
Ammoniacal Horizontal line (producer: Universal) 1
 
   

TYPE OF TREATMENT FOR MULTILAYERS PCB INNERLAYERS

EQUIPMENT DESCRIPTION QTY
Oxide replacement line Horizontal line - oxide replacement line (prod. Kuttler) 1
Black Oxide Vertical Basket line 1
Oxide replacement line Horizontal line - oxide replacement line 1
 
   

TECHNICS OF LAY UP

EQUIPMENT DESCRIPTION QTY
Post etch punch Piergiacomi 1
Thermal welding Piergiacomi 1
Thermal welding Cedal 1
Pinless Lay up Cedal 2
 
   

LAMINATION

EQUIPMENT DESCRIPTION QTY
High pressure, high temperature, vacuum

LAUFFER PRESS
BURKLE
BIEFFEBI
ADARA

1
2
1
1
 
   

DRILLING

EQUIPMENT DESCRIPTION QTY
Manual Spinamatic 3
Xray Target Drilling INSPECTA 3
NC.drill POSALUX
PLURITEC
SCHMOLL
EXCELLON
6
24
8
4
LASER Drill Yag & CO2 Heidelberg 1
 
   

HOLE / SURFACE PREPARATION

EQUIPMENT DESCRIPTION QTY
Chemical desmearing Vertical rack line 3
Deburning Ultrasonic / Brush / High Pressure water 3
Plasma Plasma machine 1
 
   

ELECTROLESS COPPER PLATING

EQUIPMENT DESCRIPTION QTY
Plating Through Hole Vertical rack line 3
 
   

COPPER ELECTROPLATING

EQUIPMENT DESCRIPTION QTY
Panel-Pattern PLating Vertical rack line 4
 
   

TIN/LEAD SURFACE PLATING

EQUIPMENT DESCRIPTION QTY
Tin electroplated Vertical rack line 1
Tin-Lead electroplated Vertical rack line 3
Tin lead - HASL HASL vertical machine 2
Lead free  - HASL HASL vertical machine 2
Immersion Silver Horizontal line 1
 
   

FUSING PROCESSES

EQUIPMENT DESCRIPTION QTY
Vertical HASL See the above section 4
Tin Lead fusion Horizontal line 1
 
   

NICKEL SURFACE PLATING

EQUIPMENT DESCRIPTION QTY
Electroless nickel Vertical rack line 2
Electroplated nickel Vertical rack line 1
 
   

GOLD SURFACE PLATING

EQUIPMENT DESCRIPTION QTY
Electroless gold Vertical rack line 2
Electroplated gold Vertical rack line 1
 
   

SOLDERMASK

EQUIPMENT DESCRIPTION QTY
Screened deposit image Gyrex spray 1
Curtain Coating Burkle Horizontal line 1
Liquid photoimageable Curtain coater / ink dryer 2
Semi-auto screen MUFAI 3
Legend print Orbotech inkjet legend printer 3
Printing Machine Silkscreen/Blue Mask/Carbon 3
 
   

ORGANIC SURFACE PROTECTION

EQUIPMENT DESCRIPTION QTY
Imidazole Horizontal line 2
 
   

ROUTING EQUIPMENT

EQUIPMENT DESCRIPTION QTY
Edge beveler Pluritec / Schmoll /Edgemate 5
NC router Pluritec 11
NC router Trudrill 3
NC router LENZ – Z axis & CCD Control 1
NC router Schmoll – Z axis 1
Scoring (profile) Telmec / SUC 3
Scroring (straight line) Telmec 2
 
   

ELECTRICAL TEST EQUIPMENT

EQUIPMENT DESCRIPTION QTY
Open and shorts ATG Flying Probe 6
Open and shorts MANIA Precise 2 1
Open and shorts ULTRON 4
Impedance control Polar CTIS500s 2
Impedance control Sun East 1
 
   

CONTROL EQUIPMENT

EQUIPMENT DESCRIPTION QTY
Contaminometer Metronelec contamino CT100 2
XRF CMI 900 (Oxford Instrument) 1
XRF CMI 700 (Oxford Instrument) 1
Optical Microscope
Optical Microscope
NIKON
LEICA
2
1
X,Y,Z measurement system TESA (Brown & Sharp) 1
X,Y measurement system HC TEC 1
X,Y measurement system OGP 1

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